P.O. Box 1438 - Middleboro, MA 02346
Phone: 508.946.4533 - Toll-free: 800.910.2352 Fax: 508.947.4686 - Toll-free: 800.910.2859 
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P.O. Box 1438 - Middleboro, MA 02346
Phone: 508.946.4533 - Toll-free: 800.910.2352 Fax: 508.947.4686 - Toll-free: 800.910.2859
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NEW! Machining for Nuclear Industry under 10-CFR-50 Appendix B & Part 21: 
What is 10-CFR-50 Appendix B: 10CFR50 Appendix B, Quality assurance Criteria is applied to the design, fabrication, construction, and testing of the structures, systems, and components of the nuclear power plants. In layman's terms, we call the 10CFR50 Appendix B "Code". The Code is written by US Nuclear Regulatory Commission (NRC) and has 18 Criteria. The Code is written very brief and vague. In the past, the Code has been wrongfully interpreted by some end users. American Nuclear Standard Institute (ANSI) and American Society of Mechanical Engineers (ASME), have developed more clear standards for implementation of the Code. ANSI N45.2 and daughter standards and ASME NQA-1 have described the Code requirements and implementation of all 18 Criteria in more details for the end users. NRC has approved those standards and agreed that the standards are more detailed to mitigate any wrong interpretation and implementation of the Code. NRC has issued Regulatory Guides (Reg. Guides) and endorsed the stated ANSI and ASME Codes for Quality Assurance Program Requirements of Nuclear Power Plants.
NEW! Submarine Parts machining under Sub-Safe Level 1 & SDI.(source direct inspection) 
What does Sub-Safe mean: SUBSAFE is a quality assurance program of the United States Navy assigned to maintain the safety of the nuclear submarine fleet; specifically, to provide maximum reasonable assurance that subs' hulls will stay watertight, and that they can recover from unanticipated flooding. SUBSAFE covers all systems exposed to sea pressure or critical to flooding recovery. All work done and all materials used on those systems are tightly controlled to ensure the material used in their assembly as well as the methods of assembly, maintenance, and testing are correct. They require certification with traceable quality evidence. These measures increase the cost of submarine construction and maintenance. SUBSAFE addresses only flooding; mission assurance is not a concern, simply a side benefit. Other safety programs and organizations regulate such things as fire safety, weapons systems safety, and nuclear reactor systems safety. NEW! Large Shaft Balancing up to (14' OD x 500" long) NEW! Electronic Assembly: Turnkey or Consignment Assembly Old Technology or New or Combination of Both. ROHS or Lead Solder. IPC standards Used throughout assembly process Full SMD Capabilities as Well as Through Hole. Old Technology  New Technology  Box Builds  NEW! Large Router (Milling) X axis = 134" x Y axis = 84" x Z axis = 9" with Vacuum Table ( X axis 120" x Y axis 60"). 63 inches between Gantry Coluums. Optional 4th axis aggregate included.Advantages: The ability to run multiple parts at once (large & small) Order full sheets of material and not having to have pre-cut which saves on handling. For instance 2" x 3" acrylic windows out of a 4' x 4' sheet, the vacuum allows it to be machine complete 164 parts in 1 set-up. This saves money on both ends. The material buy ( because the distributor just pulls a full sheet and doesn't have to saw cut) and the machine time that would have to be used to do 1 part at a time. Another advantage for vacuum is the ability to machine a part complete without having to use mechanical fixtures and to set-up and relocate part again. This saves time, money and the fact that once you move a part it is almost impossible to get back to the exact same spot. For instance a part for Sikorsky ( long aluminum piece) When done on a conventional miller you would have to mechanically fixture and move the part ( 80" long). The first time the job was run using the Vacuum table the feedback was" These are the best parts we ever got" . This was due to the fact when using a vacuum table you are applying the same amount of pressure over the entire part. Uses: Flat and panel machined components,Enclosures,Electrical Insulators,Lab Tops and Cart Tops, Panel and Plate Processing,Nested Based Components,Templates,Patterns, 3D Artwork etc. Materials: Acrylics, HDPE, Delrin, Plastics,Aluminum, Extrusion Modification, Phenolics, Composites, Foam, Solid Surface (Corian etc.) Honeycomb Panels, Hardwood and Softwood etc. 
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Commercial, Residential, Ornamental Railings. Our railings cover a wide variety of applications, from small ornamental railings, to an entire building's railings. Our railings are built to the highest standards so that you the customer have the best railings that you can get. Railings and handrails built for
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Custom Made Marine Components:
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Centerless Grinding:   Centerless Grinding Capabilities:
Precision centerless grinding of all metals and plastics. Centerless grinding is a method of material removal through grinding, similar to centered grinding except for the absence of the spindle. It has high through-put, i.e. large number of parts can be manufactured in a short time. The workpiece is set up between the regulating wheel (or back up wheel) and the grinding wheel, and is supported by the work blade (or work rest). Both wheels are rotated in the same direction. The work rest is located between the wheels. The work is placed upon the work rest, and the latter, together with the regulating wheel is fed forward, forcing the works against the grinding wheel. The axial movement of the work past the grinding wheel is obtained by tilting the regulating wheel at a slight angle from Centerless grinding is classified into two types:
Some of the benefits of centerless grinding include the ability to grind parts with geometries that do not allow them to be OD ground, the ability to remove three, five and other odd numbered lobing on the shaft of a part, and to maintain size beyond what is typically capable of an OD grinder due to the low overall pressures spaced out along the workpiece. Plunge Grinding:
In-feed (Plunge) Grinding is used to grind workpieces which have projections or shoulders, multiple diameters or other irregular shapes which preclude the use of throughfeed grinding. The wheels are opened to allow for the part to be loaded (from above if multi-diameters). Most often the part is fed along with the blade and regulating wheel to a set finish position against a stationary grinding wheel. The grinding wheel must have sufficient width to cover the entire surface being ground. In many cases, the desired shape is cut into the face of the wheel either by single point diamond trueing or by diamond roll crush trueing. Diamond roll trueing is used on intricate shapes which are difficult to form with a single point diamond. NEW!
Back Lapping: Back lapping is the process of thinning wafers by removing material from the rear of an object, ie., the unpolished face. This is performed to change the mechanical, electrical or optical properties of the material. Consideration of the residual strength of the material after back lapping must be evaluated in order to determine the proper mounting method. The choice is a permanent bond, or a temporary bond. This choice depends on the future usage of the material. The final decision will be the accuracy required in the final thickness and thickness variation. Typical Materials:
Wafers from 150mm dia. to die level at 7mm square can be produced using Back-Lapping. Thicknesses available will depend on size of substrate and type of material being processed. NEW!
Die Level Lapping & Polishing : Relying on extensive knowledge in lapping and polishing - Die level lapping and polishing are available. With precision machines and tooling parts as small as 7mm square to 26mm square can be lapped and polished. Materials Processed:
Typical thickness tolerances for die level application +/- 10 microns (tighter tolerances available upon request). Utilizing our proprietary processes and tooling, we are capable of angular lapping and polishing to tolerances of +/-0.05 °. Benefits to Die Level Lapping and Polishing are:
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Polishing: Advanced level polishing requires that appropriate abrasive and pre-lapping conditions be used to significantly reduce sub-surface damage.Advanced Level Polishing requires using both mechanical and CMP (chemical mechanical process) depending on the customers requirements. Industry standard materials polished are 99.6% Alumina, 96% Alumina, AlN, BeO, Sapphire, Fused Silica. Virtually any ferrous or non ferrous material can be polished. Controlling the polishing process controls the surface finish and, combined with the expert lapping process, assures thickness identity and parallelism, as well as flatness of substrates. All lapping and polishing processes are custom designed for each type of material and the physical dimensions required.
Why Polish Substrates? While many customers will be satisfied with an as-fired surface for their applications, others may require a smoother, more parallel surface finish. The reasons for this are varied, but generally fall under the following requirements: Finer Line Geometries An as-fired surface finish is generally adequate for lines as thin as 1 mil in thin-film applications and 5 mils in thick film applications. Forming finer lines than these on as-fired surfaces will exhibit poor pattern definition resulting in increased conductor resistance, which inhibits current flow and reduces circuit performance. Poor pattern definition can also contribute to performance anomalies in RF and microwave circuits.
Thinner Metallization Layers Polishing reduces the amplitude of peaks and valleys on the surface enabling the use of significantly thinner metalization layers. Thinner resistor layers increase the sheet resistance of the material thereby allowing the formation of higher value resistors when using thin-film technology - especially when serpentine patterns are used. Better Top and Bottom Surface Parallelism Lapping and polishing the substrate results in improved parallelism between the top and bottom surfaces. The benefit is tighter control over substrate capacitance and inductance when the substrate is metalized and patterned. Since capacitance and inductance are the major factors that determine impedance, the improved parallelism results in better RF and Microwave circuit predictability and performance. Controlling the camber (flatness) also greatly improves the transfer of the photo mask patterns to the substrate surface thus allowing finer lines and spaces. Better Optical Performance The very nature of fabricated optical devices demands surface smoothness and flatness beyond that typically required by microelectronics. Generally, light must be precisely moved around, bent, reflected, split, sent through fibers, and used in ways that were not intended by nature. All of this has to be accomplished with as little loss of light as possible. In most cases, the colors can't be altered or shifted within the spectrum. Polishing and super polishing are the only means that can achieve highly reflective or transmissive surfaces. The surface must be polished and flattened to a small fraction of a wavelength for optimum performance. NEW!
Laser Machining Substrates can be laser drilled, scribed or cut to customer specifications. Tolerances for Ceramic and Aluminum Nitride Cut edge or alignment flats +/- .001'' Internal features to other features +/- .001'' Hole Diameter with pin gage +/- .001'' Hole Taper: Scribe Depth:
Pulse Spacing: NEW!
Diamond Sawing and Machining Computerized diamond saws and CNC controlled surface grinders capable of scribing or dicing a variety of shaped parts up to .200” thick. Diamond machined edges, bevels, V grooves and chamfers can be provided per your specifications. Benefits of Dicing Substrates:
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Laser Welding 
Laser welding is a fusion process where metal is melted to join components together or a filler wire is melted onto the surface to build up areas. Heat is produced and there will be a heat affected zone (HAZ), but generally the heat input into a laser welded job is a small fraction of that produced using conventional welding techniques. The huge energy density of laser (usually NdYag) is the essential reason why laser is so precise and neat a process; a 2mm penetration weld performed with a laser will typically result in a 60% narrower weld and an 80% smaller molten weld pool compared with TIG welding. Where do you gain with laser welding?
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Gear Cutting & Hobbing: 
MATERIALS: Steel, stainless steel, aluminum, nylon, fiber (phenolic), bronze, brass, cast iron EXPRESS GEAR: When You Need It FAST! Spur, Bevel, Helical, Internal, Worm & Worm Gears Made complete to YOUR specifications Two Weeks, One Week, Two Days NEW!
Precision Surface Grinding-14" x 36" NEW!
OD Grinding-72" between centers x 10" Dia. NEW!
ID Grinding-12" ID. NEW!
Blanchard Grinding 21"H x 46" L   Blanchard grinding is used to quickly remove stock from one side of a large part. Typically, ferrous metals are subjected to the Blanchard grinding process, since the part is often held in place by a magnetic chuck as it is ground. It is, however, possible to use Blanchard grinding on non-ferrous metals and even plastics, but production rates tend to be lower and costs are higher (due to added setup time). Blanchard grinding leaves a specific finish pattern on surfaces, produced by the nature of the operation, and of the movement of grinding tools across the surface. Technically referred to as rotary surface grinding, the process is ideal for surfaces too large for disc grinding, such as plate stock, die blocks and rotary tables. Although it uses far more horsepower than other grinding services, turnaround time is much faster for certain parts; the process can be used simultaneously on multiple parts, as well, also leading to reduced production times and expense. In a Blanchard grinding machine, the grinding wheel is mounted on a vertical spindle, and moves in a direction counter to the rotation of the magnetic chuck. Before grinding, surfaces should be relatively even, without any significant protrusions. The tolerances provided by Blanchard grinding machines can be as little as one-thousandth of an inch, with similar flatness. Tolerances, however, vary between materials and work pieces. Due to the design and operation of a Blanchard grinding machine, it will grind different work pieces to a uniform size, a benefit for extensive production runs. NEW!
Double Disc Grinding up to 18" thick x 28" x 28"  Double disc grinding offers a highly productive and accurate means for machining to-size parts with flat and parallel sides. In this grinding method, two opposed abrasive discs, each mounted on its own spindle, simultaneously grind opposite and parallel faces on pieces traversed between them via any of several fixturing/carrier techniques. Because multiple parts are ground on both sides simultaneously, production rates are generally greater than those obtained with surface grinding. The economy of double disc grinding is of prime importance in the cost reduction considerations. Double disc grinding combines high production and precise control of size, flatness, parallelism, or surface finish. NEW!
Speedfam Thrufeed Grinding From 1/8 thick Small Parts to Parts up to 5" thick x 5 ½ wide x 72" Long Flat Sheets  Speedfam Thrufeed Grinding can grind any flat surface all the way to the dimensional limits continuously without delays or interruption the Speedfam Thru-Feed Grinder has the ability to hold extremely close tolerances. Machine Grinds one Side at a Time. Material Must be Magnetic. NEW!
FFL: Federal Firearms License NEW!
Veteran Owned and Woman Owned Machine Shops NEW!
Deep Hole Drilling: 1/8 Dia. To 1 ¼ Dia. X up to 48" Deep. "What is considered a deep hole?" Gundrilling is an very old process of drilling long or deep holes, first used in the making of gun barrels more than 100 years ago. Today's technology with refined machinery and tool design has made gun drilling a reliable high production method for drilling short holes as well as deep holes. The gundrill consists of a hollow tube with a " V" shaped groove or flute along its length, and a carbide cutting tip designed in such a way as to produce it's own guide bushing as it drills the hole. High pressure coolant is introduced into the center of the drill tube through the spindle of the gun drilling machine to help break and evacuate the chips along the "V" groove of the tool and out of the hole. Gundrilling provides very close tolerance straight holes with excellent surface finish. Gundrilling is able to produce holes as small as .031" With conventional drills such as twist drills several cycles or pecks would be required to clear chips from the flutes of the drill. With a dedicated deep hole drilling machine and proper tooling and fixturing the hole can be produced in one pass. Depth to diameter ratios of up to 300:1 can be achieved. Good surface finish and hole size may eliminate secondary reaming, or honing operations. NEW!
Why Multi Axis Turning  By introducing multi-tasking 9-axis machines with simultaneous 4+4 axis control, it is now even easier to produce intricate parts without the need of multiple set-ups. NEW!
Mitsubishi Laser with Pallet Shuttle 6' x 12' NEW!
Komat'su Fine Plasma Cutting System(s) NEW! CNC 4 AXIS SUBMERGED WIRE EDM NEW! Zeiss Prismo: X = 47.24 Y = 70.87 Z = 39.37  |
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